USB 3.0 Specifications To Be Revealed November 17

On November 17 the SuperSpeed USB (USB 3.0) Developers Conference, hosted by the USB Implementers Forum in San Jose, Calif., will unveil the USB 3.0 specification to the industry, according to a statement Wednesday from USB-IF President Jeff Ravencraft at the Windows Hardware Engineering Conference (WinHEC) in Los Angeles>

The USB 3.0 specification is significant because all future PCs and devices will use connectors based on it. The spec is also expected to offer 10 times the speed of USB 2.0 or roughly 5 gigabits per second.

Hewlett-Packard, Intel, NEC, NXP Semiconductors, Microsoft, and Texas Instruments are all backers of SuperSpeed USB.

Intel and Nvidia had been skirmishing over the standard but resolved their differences.

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